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Siehe Technische Spezifikationen

BCM20737S +BOM

RF System on a Chip - SoC Single-Chip BT

Hersteller:

BROADCOM
Herstellerteil #:

BCM20737S
Datenblatt:

BCM20737S Datenblatt (PDF)
Type:

BLE
Core:

ARM Cortex M3
Packaging:

Tray
Interface Type:

SPI, UART
EDA/CAD Modelle:

Fordern Sie kostenlose CAD-Modelle für an BCM20737S

Email: [email protected]

Skype: live:.cid.ab6b29428937b76

Tel: +852 95804164

BCM20737S Allgemeine Beschreibung

IC RF TxRx + MCU Bluetooth Bluetooth v4.0 2.4GHz 48-TFLGA

Hauptmerkmale

Low power consumption: It is optimized for battery-powered devices, making it suitable for wearable devices, health monitors, and other IoT gadgets.
Integrated microcontroller: It includes an ARM Cortex-M3 MCU, which allows for on-chip processing and control capabilities.
Advanced connectivity: BCM20737S supports Bluetooth 1 standards, ensuring compatibility with various devices and providing reliable wireless connectivity.
Rich peripheral integration: It provides a range of interfaces such as GPIOs, UART, SPI, I2C, and ADC, making it flexible for connecting to external sensors and devices.
Secure connections: It offers security features like encryption, pairing, and authentication to ensure secure data transmission.

Anwendung

Wearable devices: Fitness trackers, smartwatches, and health monitors often utilize BCM20737S for low-power Bluetooth connectivity.
Internet of Things (IoT): It is suitable for smart home automation, smart locks, sensors, and other IoT applications.
Proximity beacons: BCM20737S can be used in beacons to provide location-based services in retail, hospitality, and other industries.
Smart wireless peripherals: It can be integrated into wireless keyboards, mice, game controllers, and other peripherals to enable wireless connectivity.
Equivalent or alternative parts list for BCM20737S varies depending on the specific requirements and availability, but some alternatives you may consider are:
Nordic Semiconductor nRF52832
Texas Instruments CC2640R2F
Dialog Semiconductor DA14585
Silicon Labs EFR32BG13
It is recommended to consult the manufacturers' datasheets and technical specifications to ensure compatibility and suitability for specific project requirements.

Spezifikationen

Product Category:	RF System on a Chip - SoC	Type:	BLE
Core:	ARM Cortex M3	Packaging:	Tray
Interface Type:	SPI, UART	Moisture Sensitive:	Yes
Product Type:	RF System on a Chip - SoC	Factory Pack Quantity:	377
Subcategory:	Wireless & RF Integrated Circuits	Technology:	Si

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Verpackung

AVAQ bestimmt und verpackt alle Geräte auf der Grundlage der Schutzanforderungen gegen elektrostatische Entladung (ESD) und Feuchtigkeitsempfindlichkeit (MSL)..