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ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 300MHz 324-NFBGA (15x15)
324-NFBGA (15x15)Hersteller:
Herstellerteil #:
AM3357BZCZD30
Datenblatt:
Pbfree Code:
Yes
Part Life Cycle Code:
Active
Reach Compliance Code:
compliant
ECCN Code:
5A992.C
EDA/CAD Modelle:
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The AM335x microprocessors, based on the ARM Cortex-A8 processor, are enhanced with image, graphics processing, peripherals and industrial interface options such as EtherCAT and PROFIBUS. The devices support high-level operating systems (HLOS). Processor SDK Linux® and TI-RTOS are available free of charge from TI.
The AM335x microprocessor contains the subsystems shown in the Functional Block Diagram and a brief description of each follows:
The contains the subsystems shown in the Functional Block Diagram and a brief description of each follows:
The microprocessor unit (MPU) subsystem is based on the ARM Cortex-A8 processor and the PowerVR SGX™ Graphics Accelerator subsystem provides 3D graphics acceleration to support display and gaming effects.
The PRU-ICSS is separate from the ARM core, allowing independent operation and clocking for greater efficiency and flexibility. The PRU-ICSS enables additional peripheral interfaces and real-time protocols such as EtherCAT, PROFINET, EtherNet/IP, PROFIBUS, Ethernet Powerlink, Sercos, and others. Additionally, the programmable nature of the PRU-ICSS, along with its access to pins, events and all system-on-chip (SoC) resources, provides flexibility in implementing fast, real-time responses, specialized data handling operations, custom peripheral interfaces, and in offloading tasks from the other processor cores of SoC.
Source Content uid | AM3357BZCZD30 | Pbfree Code | Yes |
Part Life Cycle Code | Active | Reach Compliance Code | compliant |
ECCN Code | 5A992.C | HTS Code | 8542.31.00.01 |
Additional Feature | ALSO OPERATES AT MIN 0.912 V | Address Bus Width | 28 |
Bit Size | 32 | Boundary Scan | YES |
Clock Frequency-Max | 26 MHz | External Data Bus Width | 16 |
Format | FIXED POINT | Integrated Cache | YES |
JESD-30 Code | S-PBGA-B324 | JESD-609 Code | e1 |
Length | 15 mm | Low Power Mode | YES |
Moisture Sensitivity Level | 3 | Number of DMA Channels | 64 |
Number of Terminals | 324 | On Chip Data RAM Width | 8 |
Operating Temperature-Max | 90 °C | Operating Temperature-Min | -40 °C |
Peak Reflow Temperature (Cel) | 260 | Qualification Status | Not Qualified |
RAM (words) | 131072 | Seated Height-Max | 1.4 mm |
Speed | 300 MHz | Supply Current-Max | 400 mA |
Supply Voltage-Max | 1.144 V | Supply Voltage-Min | 1.056 V |
Supply Voltage-Nom | 1.1 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | INDUSTRIAL |
Terminal Finish | TIN SILVER COPPER | Terminal Form | BALL |
Terminal Pitch | 0.8 mm | Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 | Width | 15 mm |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
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