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AT91SAM9G45C-CU +BOM

Microprocessors - MPU BGA Green, IND TEMP,MRL C

Hersteller:

MICROCHIP
Herstellerteil #:

AT91SAM9G45C-CU
Datenblatt:

AT91SAM9G45C-CU Datenblatt (PDF)
Pbfree Code:

Yes
Part Life Cycle Code:

Active
Reach Compliance Code:

compliant
ECCN Code:

3A991.A.2
EDA/CAD Modelle:

Fordern Sie kostenlose CAD-Modelle für an AT91SAM9G45C-CU

Email: [email protected]

Skype: live:.cid.ab6b29428937b76

Tel: +852 95804164

AT91SAM9G45C-CU Allgemeine Beschreibung

One of the key features of the SAM9G45C-CU is its advanced connectivity options. With support for High Speed USB host and device, Ethernet, and SDIO/MMC interfaces, this processor can easily connect to a variety of peripherals and networks. Additionally, the integrated LCD controller and touchscreen support make it ideal for use in human-machine interfaces and display applications

Hauptmerkmale

Elegant Architecture
Powerful ARM926EJ-S
Efficient Cache System

Anwendung

RF communication systems
Asset tracking devices
Remote monitoring solutions

Spezifikationen

Source Content uid	AT91SAM9G45C-CU	Pbfree Code	Yes
Part Life Cycle Code	Active	Reach Compliance Code	compliant
ECCN Code	3A991.A.2	HTS Code	8542.31.00.01
Factory Lead Time	50 Weeks	Has ADC	YES
Address Bus Width	26	Bit Size	32
Boundary Scan	YES	CPU Family	ARM9
Clock Frequency-Max	50 MHz	DAC Channels	NO
DMA Channels	YES	External Data Bus Width	32
Format	FIXED POINT	Integrated Cache	YES
JESD-30 Code	S-PBGA-B324	JESD-609 Code	e1
Length	15 mm	Low Power Mode	YES
Moisture Sensitivity Level	3	Number of DMA Channels	37
Number of External Interrupts	1	Number of I/O Lines	160
Number of Serial I/Os	7	Number of Terminals	324
On Chip Data RAM Width	8	Operating Temperature-Max	85 °C
Operating Temperature-Min	-40 °C	PWM Channels	YES
Peak Reflow Temperature (Cel)	260	Qualification Status	Not Qualified
RAM (bytes)	65536	RAM (words)	65536
ROM (words)	65536	ROM Programmability	FLASH
Seated Height-Max	1.4 mm	Speed	400 MHz
Supply Voltage-Max	1.1 V	Supply Voltage-Min	0.9 V
Supply Voltage-Nom	1 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	INDUSTRIAL
Terminal Finish	TIN SILVER COPPER	Terminal Form	BALL
Terminal Pitch	0.8 mm	Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	40	Width	15 mm
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC

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Verpackung

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