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EP2C70F672C7N +BOM

Customizable integrated circuit

EP2C70F672C7N Allgemeine Beschreibung

With its impressive 70,000 logic elements, the EP2C70F672C7N FPGA from Intel's Cyclone II family sets the stage for innovation in industries such as telecommunications, automotive, and industrial automation. Boasting 672 pins, this FPGA guarantees seamless connectivity and compatibility with a variety of components, facilitating efficient data transfer and communication. Operating at a moderate speed grade denoted by "C7," this device ensures reliable performance in diverse applications. Supporting multiple I/O standards including LVDS and SSTL, the EP2C70F672C7N FPGA offers versatility in interfacing with different peripherals and devices. Packaged in a surface-mount-friendly PBGA or similar package marked with the "N" designation, it is designed for ease of installation and optimal performance in compact environments

Hauptmerkmale

High-density architecture with 4,608 to 68,416 LEs

M4K embedded memory blocks

Up to 1.1 Mbits of RAM available without reducing available logic

4,096 memory bits per block (4,608 bits per block including 512 parity bits)

Variable port configurations of 1, 2, 4, 8, 9, 16, 18, 32, and 36

True dual-port (one read and one write, two reads, or two writes) operation for 1, 2, 4, 8, 9, 16, and 18 modes

Byte enables for data input masking during writes

Up to 260-MHz operation

Embedded multipliers

Up to 150 18-18-bit multipliers are each configurable as two independent 9-9-bit multipliers with up to 250-MHz performance

Optional input and output registers

Advanced I/O support

High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL, differential HSTL, and differential SSTL

Single-ended I/O standard support, including 2.5-V and 1.8-V, SSTL class I and II, 1.8-V and 1.5-V HSTL class I and II, 3.3-V PCI and PCI-X 1.0, 3.3-, 2.5-, 1.8-, and 1.5-V LVCMOS, and 3.3-, 2.5-, and 1.8-V LVTTL

Peripheral Component Interconnect Special Interest Group (PCI SIG) PCI Local Bus Specification, Revision 3.0 compliance for 3.3-V operation at 33 or 66 MHz for 32- or 64-bit interfaces

PCI Express with an external TI PHY and an Altera PCI Express 1 Megacore function

133-MHz PCI-X 1.0 specification compatibility

High-speed external memory support, including DDR, DDR2, and SDR SDRAM, and QDRII SRAM supported by drop in Altera IP MegaCore functions for ease of use

Three dedicated registers per I/O element (IOE): one input register, one output register, and one output-enable register

Programmable bus-hold feature

Programmable output drive strength feature

Programmable delays from the pin to the IOE or logic array

I/O bank grouping for unique VCCIO and/or VREF bank settings

MultiVolt I/O standard support for 1.5-, 1.8-, 2.5-, and 3.3-interfaces

Hot-socketing operation support

Tri-state with weak pull-up on I/O pins before and during configuration

Programmable open-drain outputs

Series on-chip termination support

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Spezifikationen

Programmabe Not Verified Number of LABs/CLBs 4276
Number of Logic Elements/Cells 68416 Total RAM Bits 1152000
Number of I/O 422 Number of Gates -
Voltage - Supply 1.15V ~ 1.25V Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)

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