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IFR3000 +BOM

QUALCOMM Inventar

Hauptmerkmale

  • Supports IS-98 (CDMA) and IS-19 (AMPS) standards for dual-mode operation
  • 2.7 to 3.15 V supply voltage
  • Low current: 26 / 21 mA in CDMA Rx / FM Rx Modes
  • Rx power control through 90 dB dynamic range AGC amplifier
  • IF mixer for downconverting IF to analog baseband
  • Low-pass filtering for CDMA and FM I- and Q-component baseband signal demodulation
  • 4-bit ADCs convert CDMA I and Q analog baseband components to digital baseband
  • 8-bit ADCs convert FM I and Q analog baseband to digital baseband
  • Clock generators for CDMA / AMPS operation
  • VCO for generation of Rx LO mixing signal
  • I- and Q-channel DC offset control inputs drive baseband DC voltage offset to zero in CDMA and FM signal paths
  • Operational Mode compatibility with the MSM2300™, MSM3000® and MSM3100™ devices
  • Enhanced features with MSM3000 device through three-line serial bus interface (SBI):
  • – Slotted FM Mode
  • – Selective power-down
  • – Mode selection
  • 48-lead LQFP and 48-pin BCC packaging options for dense circuit assemblies
  • IFT3000 Device Features
  • Supports IS-98 (CDMA) and IS-19 (AMPS) standards for dual-mode operation
  • Operates on 2.7 to 3.15 V supply voltage
  • 8-bit DACs convert digital baseband signals to analog baseband
  • CDMA and FM signal paths include lowpass filters for I and Q output waveform smoothing
  • IF mixer upconverts analog baseband to IF
  • Tx power control through 85 dB dynamic range AGC amplifier
  • Programmable Tx PLL for generating Tx IF frequency
  • VCO for generation of Tx LO mixing signal
  • 8-bit general-purpose ADC with 3-input analog multiplexer and selectable input ranges
  • Operational Mode compatibility with the MSM2300 and MSM3000 devices
  • Enhanced features with MSM3000 device through three-line serial bus interface (SBI):
  • – Tx PLL phase-detector polarity
  • – Tx PLL programmability
  • – Punctured CDMA transmission
  • – Selective power-down
  • – Mode selection
  • 48-lead LQFP and 48-pin BCC packaging options for dense circuit assemblies
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