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Siehe Technische Spezifikationen

K9G8G08U0M-PCB0

8 flash memory module, 1Gx8 configuration, 20ns speed

Hersteller:

Samsung Semiconductor
Herstellerteil #:

K9G8G08U0M-PCB0
Datenblatt:

K9G8G08U0M-PCB0 Datenblatt (PDF)
Pbfree Code:

Yes
Part Life Cycle Code:

Obsolete
Reach Compliance Code:

compliant
ECCN Code:

EAR99
EDA/CAD Modelle:

Fordern Sie kostenlose CAD-Modelle für an K9G8G08U0M-PCB0

Email: [email protected]

Skype: live:.cid.ab6b29428937b76

Tel: +852 95804164

K9G8G08U0M-PCB0 Allgemeine Beschreibung

The K9G8G08U0M-PCB0 is a NAND flash memory IC manufactured by Samsung. It has a storage capacity of 8GB and utilizes a 3.3V power supply. The memory is organized into multiple blocks, each consisting of multiple pages. This NAND flash memory device uses a multi-level cell (MLC) architecture, which allows for high density storage and efficient data transfer speeds. It also features a synchronous interface for fast data access and transfer rates.The K9G8G08U0M-PCB0 is designed for use in various electronic devices such as smartphones, tablets, and solid-state drives (SSDs). It is known for its reliability, durability, and high performance.

Hauptmerkmale

NAND flash memory

8Gb capacity

Parallel interface

3V power supply

Page size of 16KB

Block erase size of 512KB

High reliability and fast read/write speeds

Ideal for data storage in various electronic devices

Anwendung

1. Solid-state drives (SSDs)
2. Mobile devices (smartphones, tablets)
3. Digital cameras
4. Gaming consoles
5. Industrial control systems

Spezifikationen

Pbfree Code	Yes	Part Life Cycle Code	Obsolete
Reach Compliance Code	compliant	ECCN Code	EAR99
HTS Code	8542.32.00.51	Access Time-Max	20 ns
Command User Interface	YES	Data Polling	NO
JESD-30 Code	R-PDSO-G48	JESD-609 Code	e6
Memory Density	8589934592 bit	Memory IC Type	FLASH
Memory Width	8	Moisture Sensitivity Level	3
Number of Sectors/Size	4K	Number of Terminals	48
Number of Words	1073741824 words	Number of Words Code	1000000000
Operating Temperature-Max	70 °C	Organization	1GX8
Page Size	2K words	Parallel/Serial	PARALLEL
Peak Reflow Temperature (Cel)	260	Power Supplies	3/3.3 V
Qualification Status	Not Qualified	Ready/Busy	YES
Sector Size	256K	Standby Current-Max	0.00005 A
Supply Current-Max	0.03 mA	Surface Mount	YES
Technology	CMOS	Temperature Grade	COMMERCIAL
Terminal Finish	TIN BISMUTH	Terminal Form	GULL WING
Terminal Pitch	0.5 mm	Terminal Position	DUAL
Toggle Bit	NO

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Verpackung

AVAQ bestimmt und verpackt alle Geräte auf der Grundlage der Schutzanforderungen gegen elektrostatische Entladung (ESD) und Feuchtigkeitsempfindlichkeit (MSL)..