Diese Website verwendet Cookies. Durch die Nutzung dieser Website stimmen Sie der Verwendung von Cookies zu. Weitere Informationen finden Sie in unseren Datenschutzrichtlinie.

Die Bilder dienen nur als Referenz,

Siehe Technische Spezifikationen

M1A3PE1500-2FGG676 +BOM

Ultra Low Density FPGAs.

Hersteller:

MICROCHIP TECHNOLOGY INC
Herstellerteil #:

M1A3PE1500-2FGG676
Datenblatt:

M1A3PE1500-2FGG676 Datenblatt (PDF)
Part Life Cycle Code:

Active
Reach Compliance Code:

compliant
HTS Code:

8542.39.00.01
Clock Frequency-Max:

350 MHz
EDA/CAD Modelle:

Fordern Sie kostenlose CAD-Modelle für an M1A3PE1500-2FGG676

M1A3PE1500-2FGG676 Allgemeine Beschreibung

Security is a top priority with the M1A3PE1500-2FGG676 FPGA, offering features such as secure boot, anti-tamper protection, and bitstream encryption to ensure that intellectual property and sensitive data are safeguarded. These security features give designers peace of mind, knowing that their designs are protected from potential threats. With the M1A3PE1500-2FGG676 FPGA, engineers can focus on pushing the boundaries of what is possible, knowing that their designs are backed by robust security features

Hauptmerkmale

The device has two 36-bit DDR3/DDR3L/LPDDR
memory interfaces
and 18 differential high speed transceivers

Spezifikationen

Part Life Cycle Code	Active	Reach Compliance Code	compliant
HTS Code	8542.39.00.01	Clock Frequency-Max	350 MHz
JESD-30 Code	S-PBGA-B676	JESD-609 Code	e1
Length	27 mm	Moisture Sensitivity Level	3
Number of CLBs	38400	Number of Equivalent Gates	1500000
Number of Inputs	444	Number of Logic Cells	38400
Number of Outputs	444	Number of Terminals	676
Operating Temperature-Max	70 °C	Operating Temperature-Min
Organization	38400 CLBS, 1500000 GATES	Packing Method	TRAY
Peak Reflow Temperature (Cel)	250	Power Supplies	1.5/3.3 V
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	Qualification Status	Not Qualified
Seated Height-Max	2.44 mm	Supply Voltage-Max	1.575 V
Supply Voltage-Min	1.425 V	Supply Voltage-Nom	1.5 V
Surface Mount	YES	Technology	CMOS
Temperature Grade	COMMERCIAL	Terminal Finish	TIN SILVER COPPER
Terminal Form	BALL	Terminal Pitch	1 mm
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	30
Width	27 mm

Servicerichtlinien und andere

After-Sales- und Abwicklungsbezogen

Zahlung

Bezahlverfahren

TT/Überweisung

Paypal

Western Union

Geldgramm

Für alternative Zahlungskanäle kontaktieren Sie uns bitte unter:

[email protected]

Versand & Verpackung

Versandart

Fedex

UPS

DHL

NTN

Verpackung

AVAQ bestimmt und verpackt alle Geräte auf der Grundlage der Schutzanforderungen gegen elektrostatische Entladung (ESD) und Feuchtigkeitsempfindlichkeit (MSL)..