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MSM8274 +BOM

Hersteller:

QUALCOMM
Herstellerteil #:

MSM8274
Datenblatt:

MSM8274 Datenblatt (PDF)
Paket/Koffer:

BGA
Produktart:

Interface ICs
EDA/CAD Modelle:

Fordern Sie kostenlose CAD-Modelle für an MSM8274

MSM8274 Allgemeine Beschreibung

SNAPDRAGON™ CPU PROCESSORSThis second generation Snapdragon CPU processor substantially improves overall user experience, increases system performance and further extends battery life. The 8x55 CPU chipset is designed specifcally for mid and high-tier smartphones as well as larger display devices such as tablets. It also includes the new AP-only option APQ8055. Supported operating systems include Android™, Blackberry®, webOS, and Windows® Phone.The 8x55 Snapdragon family of mobile CPU processors enables a fully immersive and engaging entertainment experience and designed to allow users to take full advantage of the latest in web technology.• Enables access to the broadest array of internet media with Flash10 and HTML5 video support• Video sharing and advanced camera support enables the latest in interactive technology to create, share and store memories and experiences

Hauptmerkmale

1. It is based on a quad-core processor architecture, utilizing Qualcomm's Krait cores. Each core operates at a clock speed of up to 2.3 GHz, providing high performance and efficient multitasking capabilities.
2. The SoC incorporates the Adreno 330 GPU, which ensures smooth graphics rendering and supports advanced graphical features.
3. It supports various communication technologies, including 4G LTE, 3G, and Wi-Fi, enabling fast and reliable connectivity.
4. The integrated image signal processor (ISP) supports high-resolution camera sensors and advanced imaging features.
5. It includes multiple multimedia and audio processing capabilities, enhancing the overall multimedia experience.

Anwendung

1. The MSM8274 is primarily used in smartphones and tablets as the main processing unit.
2. It can also be found in other wireless devices, such as mobile hotspots, portable gaming consoles, and smart TVs.

Spezifikationen

Product Category

IC Chips

Servicerichtlinien und andere

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Verpackung

AVAQ bestimmt und verpackt alle Geräte auf der Grundlage der Schutzanforderungen gegen elektrostatische Entladung (ESD) und Feuchtigkeitsempfindlichkeit (MSL)..