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Flash memory chip with 256 megabits organized as 8 megabytes, with a 20 nanosecond access time, in a lead-free dual in-line package with 48 pins
TSOPHersteller:
Micron Technology
Herstellerteil #:
MT29F2G08AADWP:D
Datenblatt:
ECCN (US):
EAR99
Automotive:
No
PPAP:
No
Cell Type:
NAND
EDA/CAD Modelle:
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Micron NAND Flash devices include an asynchronous data interface for high-perform ance I/O operations. These devices use a highly multiplexed 8-bit bus (DQx) to transfer commands,address, and data. There are five control signals used to implement the asyn chronous data interface: CE#, CLE, ALE, WE#, and RE#. Additional signals control hardware write protection (WP#) and monitor device status (R/B#).
Open NAND Flash Interface (ONFI) 2.2-compliant1
Multiple-level cell (MLC) technology
Organization
Page size x8: 8640 bytes (8192 + 448 bytes)
Block size: 256 pages (2048K + 112K bytes)
Plane size: 2 planes x 2048 blocks per plane
Device size: 64Gb: 4096 blocks;
128Gb: 8192 blocks;
256Gb: 16,384 blocks;
512Gb: 32,786 blocks
Synchronous I/O performance
Up to synchronous timing mode 5
Clock rate: 10ns (DDR)
Read/write throughput per pin: 200 MT/s
Asynchronous I/O performance
Up to asynchronous timing mode 5
tRC/tWC: 20ns (MIN)
Array performance
Read page: 50s (MAX)
Program page: 1300s (TYP)
Erase block: 3ms (TYP)
Operating Voltage Range
VCC: 2.73.6V
VCCQ: 1.71.95V, 2.73.6V
Command set: ONFI NAND Flash Protocol
Advanced Command Set
Program cache
Read cache sequential
Read cache random
One-time programmable (OTP) mode
Multi-plane commands
Multi-LUN operations
Read unique ID
Copyback
First block (block address 00h) is valid when shipped
from factory. For minimum required ECC, see
Error Management (page 109).
RESET (FFh) required as first command after power
on
Operation status byte provides software method for
detecting
Operation completion
Pass/fail condition
Write-protect status
Data strobe (DQS) signals provide a hardware method
for synchronizing data DQ in the synchronous
interface
Copyback operations supported within the plane
from which data is read
Quality and reliability
Data retention: 10 years
Endurance: 5000 PROGRAM/ERASE cycles
Operating temperature:
Commercial: 0C to +70C
Industrial (IT): 40C to +85C
Package
52-pad LGA
48-pin TSOP
100-ball BGA
ECCN (US) | EAR99 | Part Status | Obsolete |
Automotive | No | PPAP | No |
Cell Type | NAND | Chip Density (bit) | 2G |
Architecture | Sectored | Boot Block | No |
Block Organization | Symmetrical | Programmability | Yes |
Timing Type | Asynchronous | Interface Type | Parallel |
Minimum Operating Supply Voltage (V) | 2.7 | Typical Operating Supply Voltage (V) | 3|3.3 |
Maximum Operating Supply Voltage (V) | 3.6 | Minimum Operating Temperature (°C) | 0 |
Maximum Operating Temperature (°C) | 70 | Packaging | Tray |
Mounting | Surface Mount | PCB changed | 48 |
Pin Count | 48 | Lead Shape | Gull-wing |
After-Sales- und Abwicklungsbezogen
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Die unten angegebenen Preise dienen nur als Referenz.