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MT29F2G16AADWP-ET:D +BOM

NAND Flash Parallel 3.3V 2G-bit 48-Pin TSOP Tray

Hauptmerkmale

  • Open NAND Flash Interface (ONFI) 2.2-compliant1
  • Multiple-level cell (MLC) technology
  • Organization
  • – Page size x8: 8640 bytes (8192 + 448 bytes)
  • – Block size: 256 pages (2048K + 112K bytes)
  • – Plane size: 2 planes x 2048 blocks per plane
  • – Device size: 64Gb: 4096 blocks;
  • 128Gb: 8192 blocks;
  • 256Gb: 16,384 blocks;
  • 512Gb: 32,786 blocks
  • Synchronous I/O performance
  • – Up to synchronous timing mode 5
  • – Clock rate: 10ns (DDR)
  • – Read/write throughput per pin: 200 MT/s
  • Asynchronous I/O performance
  • – Up to asynchronous timing mode 5
  • tRC/tWC: 20ns (MIN)
  • Array performance
  • – Read page: 50µs (MAX)
  • – Program page: 1300µs (TYP)
  • – Erase block: 3ms (TYP)
  • Operating Voltage Range
  • – VCC: 2.7–3.6V
  • – VCCQ: 1.7–1.95V, 2.7–3.6V
  • Command set: ONFI NAND Flash Protocol
  • Advanced Command Set
  • – Program cache
  • – Read cache sequential
  • – Read cache random
  • – One-time programmable (OTP) mode
  • – Multi-plane commands
  • – Multi-LUN operations
  • – Read unique ID
  • – Copyback
  • First block (block address 00h) is valid when shipped
  • from factory. For minimum required ECC, see
  • Error Management (page 109).
  • RESET (FFh) required as first command after power
  • Operation status byte provides software method for
  • detecting
  • – Operation completion
  • – Pass/fail condition
  • – Write-protect status
  • Data strobe (DQS) signals provide a hardware method
  • for synchronizing data DQ in the synchronous
  • interface
  • Copyback operations supported within the plane
  • from which data is read
  • Quality and reliability
  • – Data retention: 10 years
  • – Endurance: 5000 PROGRAM/ERASE cycles
  • Operating temperature:
  • – Commercial: 0°C to +70°C
  • – Industrial (IT): –40ºC to +85ºC
  • Package
  • – 52-pad LGA
  • – 48-pin TSOP
  • – 100-ball BGA

Spezifikationen

ECCN (US) EAR99 Part Status Obsolete
Automotive No PPAP No
Cell Type NAND Chip Density (bit) 2G
Boot Block No Programmability Yes
Timing Type Asynchronous Interface Type Parallel
Typical Operating Supply Voltage (V) 3.3 Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85 Packaging Tray
Mounting Surface Mount PCB changed 48
Pin Count 48 Lead Shape Gull-wing

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