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Siehe Technische Spezifikationen

MX25L3206EM2I-12G +BOM

NOR Flash memory with Serial interface and 32M-bit capacity

Hersteller:

Macronix International
Herstellerteil #:

MX25L3206EM2I-12G
Datenblatt:

MX25L3206EM2I-12G Datenblatt (PDF)
ECCN (US):

3A991b.1.a.
HTS:

8542.32.00.71
Automotive:

No
PPAP:

No
EDA/CAD Modelle:

Fordern Sie kostenlose CAD-Modelle für an MX25L3206EM2I-12G

Email: [email protected]

Skype: live:.cid.ab6b29428937b76

Tel: +852 95804164

MX25L3206EM2I-12G Allgemeine Beschreibung

The MX25L3206EM2I-12G is a 32Mb (4MB) Serial NOR Flash memory device manufactured by Macronix. It features a 3V power supply and a 104MHz clock frequency for high-speed data read and write operations. The device is organized into 64 sectors of 64KB each, offering flexible sector erase capability.The MX25L3206EM2I-12G supports SPI interface communication, making it easy to integrate into various applications such as consumer electronics, automotive systems, industrial control systems, and more. It also features a deep power-down mode for power-saving operation when the device is not in use.This flash memory device offers a fast read speed of up to 133MHz and a write speed of up to 25MHz, allowing for quick data transfer between the memory and the host system. The MX25L3206EM2I-12G has a typical erase and program cycle time of 1.2ms per sector, making it suitable for applications that require frequent data updates.In summary, the MX25L3206EM2I-12G is a high-performance Serial NOR Flash memory device with a compact footprint and low power consumption, making it an ideal choice for a wide range of embedded systems and other applications that require reliable non-volatile storage

Hauptmerkmale

32Mbit (4M x 8) serial flash memory
Single power supply operation
Serial peripheral interface with clock support up to 150MHz
High performance with fast read speed
Low power consumption
Flexible erase capability
Wide voltage range operation

Anwendung

Communication equipment
Networking devices
Automotive electronics
Industrial control systems
Consumer electronics
Medical devices
Security systems
Smart appliances
Gaming consoles
Robotics

Spezifikationen

ECCN (US)	3A991b.1.a.	Part Status	NRND
HTS	8542.32.00.71	Automotive	No
PPAP	No	Cell Type	NOR
Chip Density (bit)	32M	Architecture	Sectored
Boot Block	No	Block Organization	Symmetrical
Address Bus Width (bit)	24	Sector Size	4Kbyte x 1024
Page Size	256byte	Number of Bits/Word (bit)	1/2
Number of Words	32M/16M	Programmability	Yes
Timing Type	Synchronous	Max. Access Time (ns)	6
Maximum Erase Time (s)	40/Chip	Maximum Programming Time (ms)	3/Page
Process Technology	CMOS	Interface Type	Serial (SPI, Dual SPI)
Minimum Operating Supply Voltage (V)	2.7	Maximum Operating Frequency (MHz)	86
Typical Operating Supply Voltage (V)	3.3	Maximum Operating Supply Voltage (V)	3.6
Programming Voltage (V)	2.7 to 3.6	Operating Current (mA)	25
Program Current (mA)	20	Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85	Supplier Temperature Grade	Industrial
Command Compatible	Yes	ECC Support	No
Support of Page Mode	No	Minimum Endurance (Cycles)	100000(Typ)
Mounting	Surface Mount	PCB changed	8
Pin Count	8	Lead Shape	Gull-wing

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Verpackung

AVAQ bestimmt und verpackt alle Geräte auf der Grundlage der Schutzanforderungen gegen elektrostatische Entladung (ESD) und Feuchtigkeitsempfindlichkeit (MSL)..