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W25M02GVZEIG +BOM

WSON-8 packaged Flash memory with 1GX2 capacity

W25M02GVZEIG Allgemeine Beschreibung

The W25M02GVZEIG from Winbond is a cutting-edge 2-gigabyte flash memory chip that is revolutionizing the world of electronic devices. With its high-speed data transfer rates and low power consumption, this chip is the perfect choice for portable gadgets such as smartphones, tablets, and digital cameras. Its serial interface makes it suitable for embedded applications, providing seamless communication with the host system. The support for the industry-standard SPI protocol ensures easy integration into existing systems, making it a versatile option for a wide range of electronic devices. Additionally, the advanced security features including hardware-based data protection and encryption guarantee the safety of stored information, a critical factor in today's digital age

Hauptmerkmale

  • New Family of SpiFlash Memories
  • – W25M02GV: 2x1G-bit / 2x128M-byte
  • – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
  • – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
  • – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
  • – Compatible SPI serial flash commands
  • Highest Performance Serial NAND Flash
  • – 104MHz Standard/Dual/Quad SPI clocks
  • – 208/416MHz equivalent Dual/Quad SPI
  • – 50MB/S continuous data transfer rate
  • – Fast Program/Erase performance
  • – More than 100,000 erase/program cycles
  • – More than 10-year data retention
  • Efficient “Continuous Read Mode”(1)
  • – Alternative method to the Buffer Read Mode
  • – No need to issue “Page Data Read” between
  • Read commands
  • – Allows direct read access to the entire array
  • Flexible “Concurrent Operations”
  • – Independent single die access
  • – Allows “Read while Program/Erase”
  • – Allows “Multi Die Program/Erase”
  • – Improves Program/Erase throughput
  • Low Power, Wide Temperature Range
  • – Single 2.7 to 3.6V supply
  • – 25mA active, 20µA standby current
  • – -40°C to +85°C operating range
  • Flexible Architecture with 128KB blocks
  • – Uniform 128K-Byte Block Erase
  • – Flexible page data load methods
  • Advanced Features
  • – On chip 1-Bit ECC for memory array
  • – ECC status bits indicate ECC results
  • – bad block management and LUT(2) access
  • – Software and Hardware Write-Protect
  • – Power Supply Lock-Down and OTP protection
  • – 2KB Unique ID and 2KB parameter pages
  • – Ten 2KB OTP pages(3)
  • Space Efficient Packaging
  • – 8-pad WSON 8x6-mm
  • – 24-ball TFBGA 8x6-mm
  • – Contact Winbond for other package options

Spezifikationen

Part Life Cycle Code Obsolete Reach Compliance Code compliant
ECCN Code EAR99 HTS Code 8542.32.00.51
Clock Frequency-Max (fCLK) 104 MHz JESD-30 Code R-PDSO-N8
Length 8 mm Memory Density 2147483648 bit
Memory IC Type FLASH Memory Width 2
Number of Functions 1 Number of Terminals 8
Number of Words 1073741824 words Number of Words Code 1000000000
Operating Mode SYNCHRONOUS Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C Organization 1GX2
Parallel/Serial SERIAL Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 3 V Seated Height-Max 0.8 mm
Supply Voltage-Max (Vsup) 3.6 V Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V Surface Mount YES
Technology CMOS Temperature Grade INDUSTRIAL
Terminal Form NO LEAD Terminal Pitch 1.27 mm
Terminal Position DUAL Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type SLC NAND TYPE Width 6 mm

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In Stock: 5.370

Minimum Order: 1

Menge. Einzelpreis Ext. Preis
1+ $5,011 $5,01
200+ $1,940 $388,00
500+ $1,872 $936,00
1000+ $1,838 $1.838,00

Die unten angegebenen Preise dienen nur als Referenz.