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W25Q128FVEIG +BOM

Flash memory with 128MX1 capacity and WSON-8 form factor

Hersteller:

Winbond Electronics
Herstellerteil #:

W25Q128FVEIG
Datenblatt:

W25Q128FVEIG Datenblatt (PDF)
Part Life Cycle Code:

Obsolete
Pin Count:

8
Reach Compliance Code:

compliant
ECCN Code:

EAR99
EDA/CAD Modelle:

Fordern Sie kostenlose CAD-Modelle für an W25Q128FVEIG

Email: [email protected]

Skype: live:.cid.ab6b29428937b76

Tel: +852 95804164

W25Q128FVEIG Allgemeine Beschreibung

The W25Q128FVEIG is a cutting-edge Serial NOR Flash memory chip designed for high performance and reliability. With a sizable capacity of 128 megabits and a voltage range of 2.7V to 3.6V, this chip is capable of meeting the demanding data storage needs of various industries. Its support for both SPI and QSPI interface protocols ensures efficient and fast data transfers, making it a suitable choice for automotive, networking, industrial, and consumer electronics applications

Hauptmerkmale

New Family of SpiFlash Memories
– W25Q128FV: 128M-bit / 16M-byte
– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
– QPI: CLK, /CS, IO0, IO1, IO2, IO3
– Software & Hardware Reset
Highest Performance Serial Flash
– 104MHz Single, Dual/Quad SPI clocks
– 208/416MHz equivalent Dual/Quad SPI
– 50MB/S continuous data transfer rate
– More than 100,000 erase/program cycles
– More than 20-year data retention
Efficient “Continuous Read” and QPI Mode
– Continuous Read with 8/16/32/64-Byte Wrap
– As few as 8 clocks to address memory
– Quad Peripheral Interface (QPI) reduces instruction overhead
– Allows true XIP (execute in place) operation
– Outperforms X16 Parallel Flash
Low Power, Wide Temperature Range
– Single 2.7 to 3.6V supply
– 4mA active current, <1µA Power-down (typ.)
– -40°C to +85°C operating range
Flexible Architecture with 4KB sectors
– Uniform Sector/Block Erase (4K/32K/64K-Byte)
– Program 1 to 256 byte per programmable page
– Erase/Program Suspend & Resume
Advanced Security Features
– Software and Hardware Write-Protect
– Power Supply Lock-Down and OTP protection
– Top/Bottom, Complement array protection
– Individual Block/Sector array protection
– 64-Bit Unique ID for each device
– Discoverable Parameters (SFDP) Register
– 3X256-Bytes Security Registers with OTP locks
– Volatile & Non-volatile Status Register Bits
Space Efficient Packaging
– 8-pin SOIC / VSOP 208-mil
– 8-pin PDIP 300-mil
– 8-pad WSON 6x5-mm / 8x6-mm
– 16-pin SOIC 300-mil (additional /RESET pin)
– 24-ball TFBGA 8x6-mm
– Contact Winbond for KGD and other options

Spezifikationen

Part Life Cycle Code	Obsolete	Pin Count	8
Reach Compliance Code	compliant	ECCN Code	EAR99
HTS Code	8542.32.00.51	Clock Frequency-Max (fCLK)	104 MHz
Data Retention Time-Min	20	Endurance	100000 Write/Erase Cycles
JESD-30 Code	R-PDSO-N8	Length	8 mm
Memory Density	134217728 bit	Memory IC Type	FLASH
Memory Width	1	Number of Functions	1
Number of Terminals	8	Number of Words	134217728 words
Number of Words Code	128000000	Operating Mode	SYNCHRONOUS
Operating Temperature-Max	85 °C	Operating Temperature-Min	-40 °C
Organization	128MX1	Parallel/Serial	SERIAL
Programming Voltage	3 V	Qualification Status	Not Qualified
Seated Height-Max	0.8 mm	Serial Bus Type	SPI
Standby Current-Max	0.00002 A	Supply Current-Max	0.02 mA
Supply Voltage-Max (Vsup)	3.6 V	Supply Voltage-Min (Vsup)	2.7 V
Supply Voltage-Nom (Vsup)	3 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	INDUSTRIAL
Terminal Form	NO LEAD	Terminal Pitch	1.27 mm
Terminal Position	DUAL	Type	NOR TYPE
Width	6 mm	Write Protection	HARDWARE/SOFTWARE

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