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Siehe Technische Spezifikationen

W25Q128FWFIG +BOM

Flash memory device for SPI communication

Hersteller:

Winbond Electronics
Herstellerteil #:

W25Q128FWFIG
Datenblatt:

W25Q128FWFIG Datenblatt (PDF)
Programmabe:

Not Verified
Memory Type:

Non-Volatile
Memory Format:

FLASH
Technology:

FLASH - NOR
EDA/CAD Modelle:

Fordern Sie kostenlose CAD-Modelle für an W25Q128FWFIG

Email: [email protected]

Skype: live:.cid.ab6b29428937b76

Tel: +852 95804164

W25Q128FWFIG Allgemeine Beschreibung

Security is a top priority with the W25Q128FWFIG, offering advanced features such as OTP 64-bit unique ID, software and hardware write protection, and a lockable OTP area for enhanced data security. These measures ensure that sensitive information remains safe and protected from unauthorized access, giving users peace of mind when it comes to data integrity

Hauptmerkmale

New Family of SpiFlash Memories
– W25Q128FW: 128M-bit / 16M-byte
– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
– QPI: CLK, /CS, IO0, IO1, IO2, IO3
– Software & Hardware Reset
Highest Performance Serial Flash
– 104MHz Single, Dual/Quad SPI clocks
– 208/416MHz equivalent Dual/Quad SPI
– 50MB/S continuous data transfer rate
– More than 100,000 erase/program cycles
– More than 20-year data retention
Efficient “Continuous Read” and QPI Mode
– Continuous Read with 8/16/32/64-Byte
Wrap
– As few as 8 clocks to address memory
– Quad Peripheral Interface (QPI) reduces
instruction overhead
– Allows true XIP (execute in place) operation
– Outperforms X16 Parallel Flash
Low Power, Wide Temperature Range
– Single 1.65 to 1.95V supply
– 4mA active current, <1µA Power-down (typ.)
– -40°C to +85°C operating range
Flexible Architecture with 4KB sectors
– Uniform Sector/Block Erase (4K/32K/64K-Byte)
– Program 1 to 256 byte per programmable page
– Erase/Program Suspend & Resume
Advanced Security Features
– Software and Hardware Write-Protect
– Power Supply Lock-Down and OTP protection
– Top/Bottom, Complement array protection
– Individual Block/Sector array protection
– 64-Bit Unique ID for each device
– Discoverable Parameters (SFDP) Register
– 3X256-Bytes Security Registers with OTP locks
– Volatile & Non-volatile Status Register Bits
Space Efficient Packaging
– 8-pin SOIC 208-mil
– 8-pad WSON 6x5-mm / 8x6-mm
– 16-pin SOIC 300-mil (additional /RESET pin)
– 24-ball TFBGA 8x6-mm
– Contact Winbond for KGD and other options

Spezifikationen

Programmabe	Not Verified	Memory Type	Non-Volatile
Memory Format	FLASH	Technology	FLASH - NOR
Memory Size	128Mbit	Memory Organization	16M x 8
Memory Interface	SPI - Quad I/O, QPI	Clock Frequency	104 MHz
Write Cycle Time - Word, Page	60µs, 5ms	Access Time	-
Voltage - Supply	1.65V ~ 1.95V	Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount

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