Diese Website verwendet Cookies. Durch die Nutzung dieser Website stimmen Sie der Verwendung von Cookies zu. Weitere Informationen finden Sie in unseren Datenschutzrichtlinie.

Die Bilder dienen nur als Referenz,

Siehe Technische Spezifikationen

W25Q16DVZPIG +BOM

High-speed SPI interface

Hersteller:

WINBOND ELECTRONICS CORP
Herstellerteil #:

W25Q16DVZPIG
Datenblatt:

W25Q16DVZPIG Datenblatt (PDF)
Part Life Cycle Code:

Obsolete
Reach Compliance Code:

compliant
ECCN Code:

3A991.B.1.A
HTS Code:

8542.32.00.51
EDA/CAD Modelle:

Fordern Sie kostenlose CAD-Modelle für an W25Q16DVZPIG

W25Q16DVZPIG Allgemeine Beschreibung

With a data retention period of up to 20 years, the W25Q16DVZPIG guarantees the long-term security of your data, giving you peace of mind. Whether you're working on consumer electronics or industrial applications, this memory chip offers the performance and durability you need for your projects

Hauptmerkmale

Family of SpiFlash Memories
– W25Q16DV: 16M-bit / 2M-byte (2,097,152)
– 256-byte per programmable page
– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
Highest Performance Serial Flash
– 104MHz Dual SPI / Quad SPI clocks
– 208/416MHz equivalent Dual/Quad SPI
– 52MB/S continuous data transfer rate
– Up to 8X that of ordinary Serial Flash
– More than 100,000 erase/program cycles
– More than 20-year data retention
Efficient “Continuous Read Mode”
– Low Instruction overhead
– Continuous Read with 8/16/32/64-Byte Wrap
– As few as 8 clocks to address memory
– Allows true XIP (execute in place) operation
– Outperforms X16 Parallel Flash
Low Power, Wide Temperature Range
– Single 2.7 to 3.6V supply
– 4mA active current, <1µA Power-down (typ.)
– -40°C to +85°C operating range
Flexible Architecture with 4KB sectors
– Uniform Sector/Block Erase (4/32/64K-bytes)
– Program one to 256 bytes
– Erase/Program Suspend & Resume
Advanced Security & Identification Features
– Software and Hardware Write-Protect
– Top/Bottom, 4KB complement array protection
– Power Supply Lock-Down and OTP protection
– 64-Bit Unique ID for each device
– Discoverable Parameters (SFDP) Register
– 3X256-Byte Security Registers with OTP locks
– Volatile & Non-volatile Status Register Bits
Space Efficient Packaging(1)
– 8-pin SOIC 150/208-mil
– 8-pad WSON 6x5-mm
– 8-pad USON 4X3mm / 4X4mm
– 8-pin PDIP 300-mil
– 16-pin SOIC 300-mil
– 24-ball TFBGA 8x6-mm (6x4/5x5 ball array)
– Contact Winbond for KGD and other options

Spezifikationen

Part Life Cycle Code	Obsolete	Reach Compliance Code	compliant
ECCN Code	3A991.B.1.A	HTS Code	8542.32.00.51
Clock Frequency-Max (fCLK)	104 MHz	Data Retention Time-Min	20
Endurance	100000 Write/Erase Cycles	JESD-30 Code	R-PDSO-N8
Length	6 mm	Memory Density	16777216 bit
Memory IC Type	FLASH	Memory Width	8
Number of Functions	1	Number of Terminals	8
Number of Words	2097152 words	Number of Words Code	2000000
Operating Mode	SYNCHRONOUS	Operating Temperature-Max	85 °C
Operating Temperature-Min	-40 °C	Organization	2MX8
Parallel/Serial	SERIAL	Power Supplies	3/3.3 V
Programming Voltage	2.7 V	Qualification Status	Not Qualified
Seated Height-Max	0.8 mm	Serial Bus Type	SPI
Standby Current-Max	0.000005 A	Supply Current-Max	0.025 mA
Supply Voltage-Max (Vsup)	3.6 V	Supply Voltage-Min (Vsup)	2.7 V
Supply Voltage-Nom (Vsup)	3 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	INDUSTRIAL
Terminal Form	NO LEAD	Terminal Pitch	1.27 mm
Terminal Position	DUAL	Type	NOR TYPE
Width	5 mm	Write Protection	HARDWARE/SOFTWARE

Servicerichtlinien und andere

After-Sales- und Abwicklungsbezogen

Zahlung

Bezahlverfahren

TT/Überweisung

Paypal

Western Union

Geldgramm

Für alternative Zahlungskanäle kontaktieren Sie uns bitte unter:

[email protected]

Versand & Verpackung

Versandart

Fedex

UPS

DHL

NTN

Verpackung

AVAQ bestimmt und verpackt alle Geräte auf der Grundlage der Schutzanforderungen gegen elektrostatische Entladung (ESD) und Feuchtigkeitsempfindlichkeit (MSL)..