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W25Q256FVEIG +BOM

**256 Megabit Flash Memory IC:** This product is a surface mount tube flash memory with a capacity of 256 megabits

Hersteller:

Winbond Electronics
Herstellerteil #:

W25Q256FVEIG
Datenblatt:

W25Q256FVEIG Datenblatt (PDF)
Programmabe:

Not Verified
Memory Type:

Non-Volatile
Memory Format:

FLASH
Technology:

FLASH - NOR
EDA/CAD Modelle:

Fordern Sie kostenlose CAD-Modelle für an W25Q256FVEIG

Email: [email protected]

Skype: live:.cid.ab6b29428937b76

Tel: +852 95804164

W25Q256FVEIG Allgemeine Beschreibung

The W25Q256FVEIG flash memory chip by Winbond is a powerhouse of performance and efficiency. With a generous capacity of 256 megabits and a low operating voltage range of 2.7V to 3.6V, this chip is designed to meet the demands of modern devices. Its integration of a Serial Peripheral Interface (SPI) ensures seamless communication with other components, enabling swift data transfers at speeds of up to 104MHz. Whether utilizing Standard SPI or Dual/Quad SPI operation, this chip delivers exceptional flexibility and performance, adapting to diverse application needs

Hauptmerkmale

New Family of SpiFlash Memories
– W25Q256FV: 256M-bit / 32M-byte
– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
– 3 or 4-Byte Addressing Mode
– Software & Hardware Reset
Highest Performance Serial Flash
– 104MHz Standard/Dual/Quad SPI clocks
– 208/416MHz equivalent Dual/Quad SPI
– 50MB/S continuous data transfer rate
– More than 100,000 erase/program cycles
– More than 20-year data retention
Efficient “Continuous Read”
– Continuous Read with 8/16/32/64-ByteWrap
– As few as 8 clocks to address memory
– Quad Peripheral Interface (QPI) reduces instruction overhead
– Allows true XIP (execute in place) operation
– Outperforms X16 Parallel Flash Low Power, Wide Temperature Range
– Single 2.7 to 3.6V supply
– 4mA active current, <1µA Power-down (typ.)
– -40°C to +85°C operating range
Flexible Architecture with 4KB sectors
– Uniform Sector/Block Erase (4K/32K/64K-Byte)
– Program 1 to 256 byte per programmable page
– Erase/Program Suspend & Resume
Advanced Security Features
– Software and Hardware Write-Protect
– Power Supply Lock-Down and OTP protection
– Top/Bottom, Complement array protection
– Individual Block/Sector array protection
– 64-Bit Unique ID for each device
– Discoverable Parameters (SFDP) Register
– 3X256-Bytes Security Registers with OTP locks
– Volatile & Non-volatile Status Register Bits
Space Efficient Packaging
– 8-pad WSON 8x6-mm
– 16-pin SOIC 300-mil (additional /RESET pin)
– 24-ball TFBGA 8x6-mm
– Contact Winbond for KGD and other options

Spezifikationen

Programmabe	Not Verified	Memory Type	Non-Volatile
Memory Format	FLASH	Technology	FLASH - NOR
Memory Size	256Mbit	Memory Organization	32M x 8
Memory Interface	SPI - Quad I/O, QPI	Clock Frequency	104 MHz
Write Cycle Time - Word, Page	50µs, 3ms	Access Time	-
Voltage - Supply	2.7V ~ 3.6V	Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount

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