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Siehe Technische Spezifikationen

W25Q64DWZPIG +BOM

8 flash memory chip, 256Kx32 capacity, 7.5ns operating speed, 6x5mm dimensions and green in color

Hersteller:

WINBOND ELECTRONICS CORP
Herstellerteil #:

W25Q64DWZPIG
Datenblatt:

W25Q64DWZPIG Datenblatt (PDF)
Part Life Cycle Code:

Not Recommended
Pin Count:

8
Reach Compliance Code:

compliant
ECCN Code:

EAR99
EDA/CAD Modelle:

Fordern Sie kostenlose CAD-Modelle für an W25Q64DWZPIG

W25Q64DWZPIG Allgemeine Beschreibung

Designed for reliability and versatility, the W25Q64DWZPIG flash memory chip from Winbond is a standout choice for a wide range of applications. Its efficient power management in deep power-down mode and high-speed Quad-SPI interface make it an attractive option for power-conscious and performance-driven devices. Whether it's for industrial equipment, automotive systems, or consumer electronics, this flash memory chip offers the flexibility and security features needed to meet the demands of modern technology. With its compatibility with standard SPI interfaces and RoHS compliance, the W25Q64DWZPIG is a dependable solution for designers and engineers seeking a reliable flash memory solution

Hauptmerkmale

Family of SpiFlash Memories
– W25Q64DW: 64M-bit / 8M-byte (8,388,608)
– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
– QPI: CLK, /CS, IO0, IO1, IO2, IO3
Highest Performance Serial Flash
– 104MHz Standard/Dual/Quad SPI clocks
– 208/416MHz equivalent Dual/Quad SPI
– 50MB/S continuous data transfer rate
– More than 100,000 erase/program cycles
– More than 20-year data retention
Efficient “Continuous Read” and QPI Mode
– Continuous Read with 8/16/32/64-Byte Wrap
– As few as 8 clocks to address memory
– Quad Peripheral Interface (QPI) reduces instruction overhead
– Allows true XIP (execute in place) operation
– Outperforms X16 Parallel Flash
Low Power, Wide Temperature Range
– Single 1.7 to 1.95V supply
– 4mA active current, <1µA Power-down (typ.)
– -40°C to +85°C operating range
Flexible Architecture with 4KB sectors
– Uniform Sector Erase (4K-bytes)
– Uniform Block Erase (32K and 64K-bytes)
– Program 1 to 256 byte per programmable page
– Erase/Program Suspend & Resume
Advanced Security Features
– Software and Hardware Write-Protect
– Top/Bottom, 4KB complement array protection
– Power Supply Lock-Down and OTP protection
– 64-Bit Unique ID for each device
– 4X256-Bytes Security Registers with OTP locks
– Volatile & Non-volatile Status Register Bits
Space Efficient Packaging
– 8-pin SOIC 208-mil
– 8-pad WSON 6x5-mm/8x6-mm
– 16-pin SOIC 300-mil
– Contact Winbond for KGD and other options

Spezifikationen

Part Life Cycle Code	Not Recommended	Pin Count	8
Reach Compliance Code	compliant	ECCN Code	EAR99
HTS Code	8542.32.00.51	Access Time-Max	7.5 ns
Additional Feature	TOP/BOTTOM BOOT BLOCK	Clock Frequency-Max (fCLK)	104 MHz
Data Retention Time-Min	20	Endurance	100000 Write/Erase Cycles
JESD-30 Code	R-PDSO-N8	Length	6 mm
Memory Density	8388608 bit	Memory IC Type	FLASH
Memory Width	32	Number of Functions	1
Number of Terminals	8	Number of Words	262144 words
Number of Words Code	256000	Operating Mode	SYNCHRONOUS
Operating Temperature-Max	85 °C	Operating Temperature-Min	-40 °C
Organization	256KX32	Parallel/Serial	SERIAL
Power Supplies	1.8 V	Programming Voltage	1.8 V
Qualification Status	Not Qualified	Seated Height-Max	0.8 mm
Serial Bus Type	SPI	Standby Current-Max	0.00002 A
Supply Current-Max	0.04 mA	Supply Voltage-Max (Vsup)	1.95 V
Supply Voltage-Min (Vsup)	1.7 V	Supply Voltage-Nom (Vsup)	1.8 V
Surface Mount	YES	Technology	CMOS
Temperature Grade	INDUSTRIAL	Terminal Form	NO LEAD
Terminal Pitch	1.27 mm	Terminal Position	DUAL
Type	NOR TYPE	Width	5 mm
Write Protection	HARDWARE/SOFTWARE

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