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W25Q80BVSSIG +BOM

Plastic green flash memory chip with 8MX1 capacity in a PDSO8 package

Hersteller:

Winbond Electronics
Herstellerteil #:

W25Q80BVSSIG
Datenblatt:

W25Q80BVSSIG Datenblatt (PDF)
Part Life Cycle Code:

Obsolete
Pin Count:

8
ECCN Code:

EAR99
HTS Code:

8542.32.00.51
EDA/CAD Modelle:

Fordern Sie kostenlose CAD-Modelle für an W25Q80BVSSIG

Email: [email protected]

Skype: live:.cid.ab6b29428937b76

Tel: +852 95804164

W25Q80BVSSIG Allgemeine Beschreibung

The W25Q80BVSSIG is a reliable 8MB flash memory chip designed by Winbond, offering high performance and versatility for a wide range of applications. With its quad SPI interface, this chip is well-suited for use in consumer electronics, automotive systems, and industrial devices. Its voltage range of 2.7V to 3.6V makes it compatible with a variety of systems, providing flexibility and ease of integration

Hauptmerkmale

Family of SpiFlash Memories
– W25Q80BV: 8M-bit/1M-byte (1,048,576)
– 256-byte per programmable page
– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
Highest Performance Serial Flash
– 104MHz Dual/Quad SPI clocks
– 208/416MHz equivalent Dual/Quad SPI
– 50MB/S continuous data transfer rate
– Up to 8X that of ordinary Serial Flash
– More than 100,000 erase/program cycles(1)
– More than 20-year data retention
Efficient “Continuous Read Mode”
– Low Instruction overhead
– Continuous Read with 8/16/32/64-Byte Wrap
– As few as 8 clocks to address memory
– Allows true XIP (execute in place) operation
– Outperforms X16 Parallel Flash
Low Power, Wide Temperature Range
– Single 2.7 to 3.6V supply
– 4mA active current, <1µA Power-down current
– -40°C to +85°C operating range
Flexible Architecture with 4KB sectors
– Uniform Sector Erase (4K-bytes)
– Uniform Block Erase (32K and 64K-bytes)
– Program one to 256 bytes
– Erase/Program Suspend & Resume
Advanced Security Features
– Software and Hardware Write-Protect
– Top/Bottom, 4KB complement array protection
– Lock-Down and OTP array protection
– 64-Bit Unique Serial Number for each device
– Discoverable Parameters (SFDP) Register
– 3X256-Byte Security Registers with OTP locks
– Volatile & Non-volatile Status Register Bits
Space Efficient Packaging
– 8-pin SOIC 150(2)/208-mil
– 8-pad WSON 6x5-mm
– 8-pin PDIP 300-mil
– Contact Winbond for KGD and other options

Spezifikationen

Part Life Cycle Code	Obsolete	Pin Count	8
Reach Compliance Code		ECCN Code	EAR99
HTS Code	8542.32.00.51	Clock Frequency-Max (fCLK)	80 MHz
Data Retention Time-Min	20	Endurance	100000 Write/Erase Cycles
JESD-30 Code	S-PDSO-G8	Length	5.28 mm
Memory Density	8388608 bit	Memory IC Type	FLASH
Memory Width	1	Number of Functions	1
Number of Terminals	8	Number of Words	8388608 words
Number of Words Code	8000000	Operating Mode	SYNCHRONOUS
Operating Temperature-Max	85 °C	Operating Temperature-Min	-40 °C
Organization	8MX1	Parallel/Serial	SERIAL
Programming Voltage	2.7 V	Qualification Status	Not Qualified
Seated Height-Max	2.16 mm	Serial Bus Type	SPI
Standby Current-Max	0.000005 A	Supply Current-Max	0.025 mA
Supply Voltage-Max (Vsup)	3.6 V	Supply Voltage-Min (Vsup)	2.7 V
Supply Voltage-Nom (Vsup)	3 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	INDUSTRIAL
Terminal Form	GULL WING	Terminal Pitch	1.27 mm
Terminal Position	DUAL	Type	NOR TYPE
Width	5.28 mm	Write Protection	HARDWARE/SOFTWARE

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