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Siehe Technische Spezifikationen

XC3S400A-4FGG320C +BOM

Field Programmable Gate Array, 896 CLBs, 400000 Gates, 667MHz, 8064-Cell, CMOS, PBGA256

Hersteller:

XILINX
Herstellerteil #:

XC3S400A-4FGG320C
Datenblatt:

XC3S400A-4FGG320C Datenblatt (PDF)
Pbfree Code:

Yes
Part Life Cycle Code:

Transferred
Pin Count:

320
Reach Compliance Code:

compliant
EDA/CAD Modelle:

Fordern Sie kostenlose CAD-Modelle für an XC3S400A-4FGG320C

Email: [email protected]

Skype: live:.cid.ab6b29428937b76

Tel: +852 95804164

XC3S400A-4FGG320C Allgemeine Beschreibung

One of the key strengths of the XC3S400A-4FGG320C lies in its ability to deliver high performance while consuming minimal power – a combination that is highly sought after in today's design landscape. Whether it's configuring I/Os, managing clocks, or implementing advanced digital signal processing, this FPGA provides designers with the tools they need to bring their complex designs to life. The flexibility and scalability offered by the XC3S400A-4FGG320C, coupled with Xilinx's ISE Design Suite software, makes it a compelling choice for those looking to push the boundaries of what's possible in the world of digital design

Spezifikationen

Pbfree Code	Yes	Part Life Cycle Code	Transferred
Pin Count	320	Reach Compliance Code	compliant
ECCN Code	3A991.D	HTS Code	8542.39.00.01
Factory Lead Time	40 Weeks	Clock Frequency-Max	667 MHz
Combinatorial Delay of a CLB-Max	0.71 ns	JESD-30 Code	S-PBGA-B320
JESD-609 Code	e1	Length	19 mm
Moisture Sensitivity Level	3	Number of CLBs	896
Number of Equivalent Gates	400000	Number of Inputs	251
Number of Logic Cells	8064	Number of Outputs	192
Number of Terminals	320	Operating Temperature-Max	85 °C
Operating Temperature-Min		Organization	896 CLBS, 400000 GATES
Peak Reflow Temperature (Cel)	260	Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Seated Height-Max	2 mm
Supply Voltage-Max	1.26 V	Supply Voltage-Min	1.14 V
Supply Voltage-Nom	1.2 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	OTHER
Terminal Finish	TIN SILVER COPPER	Terminal Form	BALL
Terminal Pitch	1 mm	Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	Width	19 mm

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