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XC4VLX15-10SFG363C +BOM

Advanced Field-Programmable Gate Array

Hersteller:

XILINX
Herstellerteil #:

XC4VLX15-10SFG363C
Datenblatt:

XC4VLX15-10SFG363C Datenblatt (PDF)
Pbfree Code:

Yes
Part Life Cycle Code:

Transferred
Pin Count:

363
Reach Compliance Code:

not_compliant

Email: [email protected]

Skype: live:.cid.ab6b29428937b76

Tel: +852 95804164

XC4VLX15-10SFG363C Allgemeine Beschreibung

Xilinx's XC4VLX15-10SFG363C FPGA, part of the Virtex-4 family, is optimized for medium complexity designs and houses 15,000 logic cells. Its maximum operating frequency of 100 MHz ensures robust performance, and the 363-pin Fine-Pitch Ball Grid Array (FBGA) package type strikes a balance between form factor and signal integrity. With 216 user I/O pins, the XC4VLX15-10SFG363C supports a range of interfaces such as LVCMOS, LVTTL, LVDS, and differential signals, making it adaptable for communication, industrial control, and consumer electronics applications. Additionally, the FPGA boasts built-in block RAM, DSP slices, and configurable I/O standards, facilitating the efficient implementation of complex algorithms and high-speed interfaces. Programmed using Xilinx's ISE Design Suite software, the XC4VLX15-10SFG363C provides a user-friendly environment for designing, implementing, and debugging FPGA designs

Spezifikationen

Pbfree Code	Yes	Part Life Cycle Code	Transferred
Pin Count	363	Reach Compliance Code	not_compliant
ECCN Code	3A991.D	HTS Code	8542.39.00.01
Factory Lead Time	37 Weeks	Clock Frequency-Max	1028 MHz
JESD-30 Code	S-PBGA-B363	JESD-609 Code	e1
Length	17 mm	Moisture Sensitivity Level	4
Number of CLBs	1536	Number of Inputs	240
Number of Logic Cells	13824	Number of Outputs	240
Number of Terminals	363	Operating Temperature-Max	85 °C
Operating Temperature-Min		Organization	1536 CLBS
Peak Reflow Temperature (Cel)	260	Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Seated Height-Max	1.99 mm
Supply Voltage-Max	1.26 V	Supply Voltage-Min	1.14 V
Supply Voltage-Nom	1.2 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	OTHER
Terminal Finish	TIN SILVER COPPER	Terminal Form	BALL
Terminal Pitch	0.8 mm	Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	Width	17 mm

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