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Housed in a 35 x 35 mm PBGA1136 package, the XC5VFX100T-1FFG1136C is a Lead-Free component suitable for environmentally-conscious designs
FBGA-1136Hersteller:
Herstellerteil #:
XC5VFX100T-1FFG1136C
Datenblatt:
Part Life Cycle Code:
Transferred
Pin Count:
1136
Reach Compliance Code:
compliant
ECCN Code:
3A991.D
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Xilinx's XC5VFX100T-1FFG1136C FPGA stands out as a powerhouse in the Virtex-5 family, harnessing the capabilities of a 65nm CMOS technology to deliver exceptional power efficiency and speed. This FPGA, with its 100,000 logic cells, 144 SelectIO blocks, 648 user I/Os, and 15 RocketIO transceivers, is tailor-made for addressing the demands of complex digital designs and high-performance applications, facilitating seamless high-speed data transfer and system integration. Operating at a core voltage of 1.0V and supporting speeds of up to 550MHz, the XC5VFX100T-1FFG1136C also integrates PowerPC 440 processors, enabling embedded processing and system adaptability. Its reconfigurable nature further allows for flexibility in system design and development. Encased in a reliable flip-chip ball grid array (FFG) with 1136 pins, this FPGA ensures steadfast connectivity and longevity
Part Life Cycle Code | Transferred | Pin Count | 1136 |
Reach Compliance Code | compliant | ECCN Code | 3A991.D |
HTS Code | 8542.39.00.01 | Combinatorial Delay of a CLB-Max | 0.9 ns |
JESD-30 Code | S-PBGA-B1136 | JESD-609 Code | e1 |
Length | 35 mm | Moisture Sensitivity Level | 4 |
Number of CLBs | 8000 | Number of Inputs | 640 |
Number of Logic Cells | 102400 | Number of Outputs | 640 |
Number of Terminals | 1136 | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | Organization | 8000 CLBS | |
Peak Reflow Temperature (Cel) | 245 | Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Qualification Status | Not Qualified | Seated Height-Max | 3.25 mm |
Supply Voltage-Max | 1.05 V | Supply Voltage-Min | 0.95 V |
Supply Voltage-Nom | 1 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | OTHER |
Terminal Finish | TIN SILVER COPPER | Terminal Form | BALL |
Terminal Pitch | 1 mm | Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 | Width | 35 mm |
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12 Std.