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Field Programmable Gate Array with 331776-Cell
FBGA-1760Hersteller:
Herstellerteil #:
XC5VLX330-1FFG1760I
Datenblatt:
Pbfree Code:
Yes
Part Life Cycle Code:
Transferred
Pin Count:
1760
Reach Compliance Code:
not_compliant
EDA/CAD Modelle:
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The XC5VLX330-1FFG1760I FPGA from Xilinx stands out as a top-notch field-programmable gate array in the Virtex-5 family. With a whopping 330,000 logic cells, this FPGA is built to handle complex digital designs with ease. Its impressive balance of high-performance logic, digital signal processing, and serial connectivity sets it apart in the industry. The -1 speed grade ensures that it operates at the fastest speeds available for its model, making it ideal for applications that demand swift data processing. The FFG1760I package further enhances its industrial capabilities, with 1760 pins for seamless connectivity. Whether it's in telecommunications, networking, industrial automation, or aerospace, the XC5VLX330-1FFG1760I FPGA proves its versatility and adaptability time and time again. Program it, reconfigure it, and watch it excel in a multitude of tasks, showcasing its prowess in handling diverse design requirements with finesse
Pbfree Code | Yes | Part Life Cycle Code | Transferred |
Pin Count | 1760 | Reach Compliance Code | not_compliant |
ECCN Code | 3A001.A.7.A | HTS Code | 8542.39.00.01 |
Combinatorial Delay of a CLB-Max | 0.9 ns | JESD-30 Code | S-PBGA-B1760 |
JESD-609 Code | e1 | Length | 42.5 mm |
Moisture Sensitivity Level | 4 | Number of CLBs | 25920 |
Number of Inputs | 1200 | Number of Logic Cells | 331776 |
Number of Outputs | 1200 | Number of Terminals | 1760 |
Operating Temperature-Max | 100 °C | Operating Temperature-Min | -40 °C |
Organization | 25920 CLBS | Peak Reflow Temperature (Cel) | 225 |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | Qualification Status | Not Qualified |
Seated Height-Max | 3.5 mm | Supply Voltage-Max | 1.05 V |
Supply Voltage-Min | 0.95 V | Supply Voltage-Nom | 1 V |
Surface Mount | YES | Temperature Grade | INDUSTRIAL |
Terminal Finish | TIN SILVER COPPER | Terminal Form | BALL |
Terminal Pitch | 1 mm | Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 | Width | 42.5 mm |
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