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XC6SLX9-2CPG196I product overview
FBGA-196Hersteller:
Herstellerteil #:
XC6SLX9-2CPG196I
Datenblatt:
Pbfree Code:
Yes
Part Life Cycle Code:
Transferred
Pin Count:
196
Reach Compliance Code:
compliant
EDA/CAD Modelle:
Bitte füllen Sie das kurze Formular unten aus und wir werden Ihnen umgehend ein Angebot zukommen lassen..
Boasting 9,152 logic cells, 576Kbits of block RAM, and 72 DSP slices, the XC6SLX9-2CPG196I is a member of the Spartan-6 family of FPGAs, offering high performance in a small form factor. With a maximum operating speed of 293MHz and 46 user I/O pins, this FPGA is suitable for applications requiring high-speed processing and interfacing with external components. Its support for various communication protocols such as SPI, I2C, and UART further enhances its versatility, enabling seamless integration into a wide range of systems. Packaged in a 196-pin Ceramic Pin Grid Array (CPGA) package, the XC6SLX9-2CPG196I prioritizes reliability and durability, making it an ideal choice for demanding environments. Additionally, its energy-efficient operation, with a supply voltage of 1.14V to 1.26V, ensures sustainable performance in power-sensitive applications
Pbfree Code | Yes | Part Life Cycle Code | Transferred |
Pin Count | 196 | Reach Compliance Code | compliant |
ECCN Code | EAR99 | HTS Code | 8542.39.00.01 |
Clock Frequency-Max | 667 MHz | Combinatorial Delay of a CLB-Max | 0.26 ns |
JESD-30 Code | S-PBGA-B196 | JESD-609 Code | e8 |
Length | 8 mm | Moisture Sensitivity Level | 3 |
Number of CLBs | 715 | Number of Inputs | 100 |
Number of Logic Cells | 9152 | Number of Outputs | 100 |
Number of Terminals | 196 | Operating Temperature-Max | 100 °C |
Operating Temperature-Min | -40 °C | Organization | 715 CLBS |
Peak Reflow Temperature (Cel) | 260 | Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Qualification Status | Not Qualified | Seated Height-Max | 1.1 mm |
Supply Voltage-Max | 1.26 V | Supply Voltage-Min | 1.14 V |
Supply Voltage-Nom | 1.2 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | INDUSTRIAL |
Terminal Finish | TIN SILVER COPPER | Terminal Form | BALL |
Terminal Pitch | 0.5 mm | Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 | Width | 8 mm |
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12 Std.