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XCZU2EG-1SFVC784E +BOM

Harness the power and flexibility of the XCZU2EG-1SFVC784E FPGA to accelerate your automotive projects and deliver innovative solutions to the market

Hersteller:

XILINX
Herstellerteil #:

XCZU2EG-1SFVC784E
Datenblatt:

XCZU2EG-1SFVC784E Datenblatt (PDF)
Part Life Cycle Code:

Transferred
Reach Compliance Code:

compliant
ECCN Code:

5A002.A.4
HTS Code:

8542.39.00.01
EDA/CAD Modelle:

Fordern Sie kostenlose CAD-Modelle für an XCZU2EG-1SFVC784E

Email: [email protected]

Skype: live:.cid.ab6b29428937b76

Tel: +852 95804164

XCZU2EG-1SFVC784E Allgemeine Beschreibung

The XCZU2EG-1SFVC784E is a versatile and powerful member of the Zynq UltraScale+ MPSoC family, designed to meet the demanding requirements of various industries, including automotive, industrial, aerospace, and defense. With its combination of programmable logic and processing system, this device offers a flexible and integrated platform for a wide range of applications. Its dual-core ARM Cortex-A53 and Cortex-R5 processing systems, along with a Mali-400 MP2 GPU, provide the computational power needed for complex tasks. Additionally, the UltraScale+ programmable logic, DDR4 memory, and connectivity options such as Gigabit Ethernet, USB, PCIe, and SATA make it a comprehensive solution for diverse use cases. Packaged in a compact 784-pin BGA package, the XCZU2EG-1SFVC784E is able to deliver a high level of integration while operating within the industrial temperature range, ensuring reliability in harsh environments

Spezifikationen

Part Life Cycle Code	Transferred	Reach Compliance Code	compliant
ECCN Code	5A002.A.4	HTS Code	8542.39.00.01
Factory Lead Time	52 Weeks	JESD-30 Code	S-PBGA-B784
JESD-609 Code	e1	Moisture Sensitivity Level	4
Number of Terminals	784	Operating Temperature-Max	100 °C
Operating Temperature-Min		Peak Reflow Temperature (Cel)	250
Supply Voltage-Nom	0.85 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	OTHER
Terminal Finish	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Terminal Form	BALL
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	30
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR CIRCUIT

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AVAQ bestimmt und verpackt alle Geräte auf der Grundlage der Schutzanforderungen gegen elektrostatische Entladung (ESD) und Feuchtigkeitsempfindlichkeit (MSL)..