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Siehe Technische Spezifikationen

XCZU3CG-1SFVC784I +BOM

FPGA Zynq UltraScale+ Family 154350 Cells 20nm Technology 0.85V 784-Pin FCBGA Tray

Hersteller:

XILINX
Herstellerteil #:

XCZU3CG-1SFVC784I
Datenblatt:

XCZU3CG-1SFVC784I Datenblatt (PDF)
Part Life Cycle Code:

Transferred
Reach Compliance Code:

compliant
ECCN Code:

5A002.A.4
HTS Code:

8542.39.00.01
EDA/CAD Modelle:

Fordern Sie kostenlose CAD-Modelle für an XCZU3CG-1SFVC784I

Email: [email protected]

Skype: live:.cid.ab6b29428937b76

Tel: +852 95804164

XCZU3CG-1SFVC784I Allgemeine Beschreibung

Featuring a Zynq UltraScale+ programmable logic IC, the XCZU3CG-1SFVC784I is a cutting-edge device with multi-processor system-on-chip (MPSoC) capabilities. This versatile member of the Xilinx Zynq family boasts a Quad-core Arm Cortex-A53 and Dual-core Arm Cortex-R5, supported by advanced graphics processing units and programmable logic blocks. With a maximum of 784 K logic cells, 780 Kb of Block RAM, 600 DSP slices, and 76,800 LUTs, the XCZU3CG-1SFVC784I delivers impressive performance and flexibility. Its connectivity options include Gigabit Ethernet, PCIe Gen3, and support for DDR4 memory interfaces, meeting diverse integration needs. Additionally, the device offers support for various video codecs and hardware acceleration for machine learning, making it suitable for compute-intensive applications. The programmable logic capabilities enable customization of algorithms and implementation of hardware accelerators, allowing users to tailor the device to specific requirements

Spezifikationen

Part Life Cycle Code	Transferred	Reach Compliance Code	compliant
ECCN Code	5A002.A.4	HTS Code	8542.39.00.01
Factory Lead Time	52 Weeks	JESD-30 Code	S-PBGA-B784
JESD-609 Code	e1	Moisture Sensitivity Level	4
Number of Terminals	784	Operating Temperature-Max	100 °C
Operating Temperature-Min	-40 °C	Peak Reflow Temperature (Cel)	250
Supply Voltage-Nom	0.85 V	Surface Mount	YES
Technology	CMOS	Temperature Grade	INDUSTRIAL
Terminal Finish	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Terminal Form	BALL
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	30
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR CIRCUIT

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