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Flash, 8MX8, PBGA16, WLCSP-16
BGA16Hersteller:
WINBOND ELECTRONICS CORP
Herstellerteil #:
W25Q64FVBYIQ
Datenblatt:
Part Life Cycle Code:
Not Recommended
Reach Compliance Code:
compliant
ECCN Code:
EAR99
HTS Code:
8542.32.00.51
EDA/CAD Modelle:
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FEATURES Family of SpiFlash Memories– W25Q64FV: 64M-bit / 8M-byte (8,388,608)– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– QPI: CLK, /CS, IO0, IO1, IO2, IO3 Highest Performance Serial Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/S continuous data transfer rate– More than 100,000 erase/program cycles– More than 20-year data retention Efficient “Continuous Read” and QPI Mode– Continuous Read with 8/16/32/64-Byte Wrap– As few as 8 clocks to address memory– Quad Peripheral Interface (QPI) reducesinstruction overhead– Allows true XIP (execute in place) operation– Outperforms X16 Parallel Flash Low Power, Wide Temperature Range– Single 2.7 to 3.6V supply– 4mA active current, <1μA Power-down (typ.)– -40°C to +85°C operating range Flexible Architecture with 4KB sectors– Uniform Sector Erase (4K-bytes)– Uniform Block Erase (32K and 64K-bytes)– Program 1 to 256 byte per programmable page– Erase/Program Suspend & Resume Advanced Security Features– Software and Hardware Write-Protect– Top/Bottom, 4KB complement array protection– Power Supply Lock-Down and OTP protection– 64-Bit Unique ID for each device– Discoverable Parameters (SFDP) Register– 3X256-Bytes Security Registers with OTP locks– Volatile & Non-volatile Status Register Bits Space Efficient Packaging– 8-pin SOIC/VSOP 208-mil– 8-pad WSON 6x5-mm/8x6-mm– 8-pad XSON 4x4-mm– 16-pin SOIC 300-mil– 8-pin PDIP 300-mil– 24-ball TFBGA 8x6-mm– 16-ball WLCSP– Contact Winbond for KGD and other options
Part Life Cycle Code | Not Recommended | Reach Compliance Code | compliant |
ECCN Code | EAR99 | HTS Code | 8542.32.00.51 |
Alternate Memory Width | 1 | Clock Frequency-Max (fCLK) | 104 MHz |
Data Retention Time-Min | 20 | JESD-30 Code | R-PBGA-B16 |
Length | 3.405 mm | Memory Density | 67108864 bit |
Memory IC Type | FLASH | Memory Width | 8 |
Number of Functions | 1 | Number of Terminals | 16 |
Number of Words | 8388608 words | Number of Words Code | 8000000 |
Operating Mode | SYNCHRONOUS | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | -40 °C | Organization | 8MX8 |
Output Characteristics | 3-STATE | Parallel/Serial | SERIAL |
Seated Height-Max | 0.512 mm | Serial Bus Type | SPI |
Standby Current-Max | 0.00005 A | Supply Voltage-Max (Vsup) | 3.6 V |
Supply Voltage-Min (Vsup) | 3 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | INDUSTRIAL |
Terminal Form | GULL WING | Terminal Pitch | 0.8 mm |
Terminal Position | BOTTOM | Width | 2.335 mm |
Write Protection | HARDWARE/SOFTWARE |
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