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Siehe Technische Spezifikationen

XC2S100-5FG256I +BOM

This FPGA operates at a clock speed of 263MHz and features a 2700-cell architecture, making it suitable for a wide range of applications

Hersteller:

XILINX
Herstellerteil #:

XC2S100-5FG256I
Datenblatt:

XC2S100-5FG256I Datenblatt (PDF)
Pbfree Code:

No
Part Life Cycle Code:

Transferred
Pin Count:

256
Reach Compliance Code:

not_compliant
EDA/CAD Modelle:

Fordern Sie kostenlose CAD-Modelle für an XC2S100-5FG256I

XC2S100-5FG256I Allgemeine Beschreibung

The XC2S100-5FG256I, a product of Xilinx, is a high-density FPGA known for its fine-pitch BGA package with 256 pins and a high-speed grade suitable for demanding applications. This FPGA offers a wide range of features, including programmable logic blocks, memory blocks, DSP slices, and various I/O options, making it a versatile and powerful solution for flexible digital circuit implementation. While the specific operating voltage is not explicitly mentioned, it likely falls within the typical range of 1.2V to 3.3V. With Xilinx's reputation for quality and innovation in the FPGA industry, the XC2S100-5FG256I is a reliable choice for complex electronic designs

Spezifikationen

Pbfree Code	No	Part Life Cycle Code	Transferred
Pin Count	256	Reach Compliance Code	not_compliant
ECCN Code	EAR99	HTS Code	8542.39.00.01
Factory Lead Time	52 Weeks	Clock Frequency-Max	263 MHz
Combinatorial Delay of a CLB-Max	0.7 ns	JESD-30 Code	S-PBGA-B256
JESD-609 Code	e0	Length	17 mm
Moisture Sensitivity Level	3	Number of CLBs	600
Number of Equivalent Gates	100000	Number of Inputs	180
Number of Logic Cells	2700	Number of Outputs	176
Number of Terminals	256	Operating Temperature-Max	100 °C
Operating Temperature-Min	-40 °C	Organization	600 CLBS, 100000 GATES
Peak Reflow Temperature (Cel)	225	Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Seated Height-Max	2 mm
Supply Voltage-Max	2.625 V	Supply Voltage-Min	2.375 V
Supply Voltage-Nom	2.5 V	Surface Mount	YES
Temperature Grade	INDUSTRIAL	Terminal Finish	TIN LEAD
Terminal Form	BALL	Terminal Pitch	1 mm
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	30
Width	17 mm

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