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XCZU3CG-1SFVA625E +BOM

XCZU3CG-1SFVA625E Integrated FPGA"

XCZU3CG-1SFVA625E Allgemeine Beschreibung

In addition to its formidable processing system, the XCZU3CG-1SFVA625E offers a generous 53,200 logic cells, 33.3Mb of block RAM, and 2660 DSP slices, making it an ideal choice for applications that demand efficient handling of signal and data-intensive tasks. Its array of I/O options, including 32.5Gb/s transceivers, PCIe Gen3 interfaces, DDR4 memory interfaces, and Gigabit Ethernet ports, further enhance its connectivity and versatility

Hauptmerkmale

  • Zynq® UltraScale+™ multiprocessor system-on-chips are available in -3, -2, -1 speed grades
  • Innovative ARM® + FPGA architecture for differentiation, analytics & control
  • Extensive OS, middleware, stacks, accelerators and IP ecosystem
  • Multiple levels of hardware and software security, architected to deliver low system power
  • Integration delivering the de facto All Programmable platform
  • Up to 5X system level performance per watt over Zynq®-7000 SoCs
  • DDR4, LPDDR4, DDR3, DDR3L, LPDDR3 dynamic memory interfaces
  • Most flexible and scalable platform for maximum reuse and best TTM
  • Industry leading design tools, C/C++, open CL design abstractions
  • PCIe® Gen2, USB3.0, SATA 3.1, DisplayPort, gigabit Ethernet high speed peripherals

Spezifikationen

Part Life Cycle Code Active Reach Compliance Code compliant
ECCN Code 5A002.A.4 HTS Code 8542.39.00.01
Factory Lead Time 52 Weeks JESD-30 Code R-PBGA-B625
JESD-609 Code e1 Moisture Sensitivity Level 4
Number of Terminals 625 Operating Temperature-Max 100 °C
Operating Temperature-Min Peak Reflow Temperature (Cel) 250
Supply Voltage-Max 0.876 V Supply Voltage-Min 0.825 V
Supply Voltage-Nom 0.85 V Surface Mount YES
Technology CMOS Temperature Grade OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Terminal Form BALL
Terminal Position BOTTOM Time@Peak Reflow Temperature-Max (s) 30
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT

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