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Siehe Technische Spezifikationen

H5TQ1G63DFR-H9C +BOM

DDR DRAM, 64MX16, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96

Hersteller:

SK HYNIX INC
Herstellerteil #:

H5TQ1G63DFR-H9C
Datenblatt:

H5TQ1G63DFR-H9C Datenblatt (PDF)
Part Life Cycle Code:

Obsolete
Pin Count:

96
ECCN Code:

EAR99
HTS Code:

8542.32.00.32
EDA/CAD Modelle:

Fordern Sie kostenlose CAD-Modelle für an H5TQ1G63DFR-H9C

Hauptmerkmale

VDD=VDDQ=1.5V +/- 0.075V
Fully differential clock inputs (CK, CK) operation
Differential Data Strobe (DQS, DQS)
On chip DLL align DQ, DQS and DQS transition with CK 
transition
DM masks write data-in at the both rising and falling 
edges of the data strobe
All addresses and control inputs except data, 
data strobes and data masks latched on the 
rising edges of the clock
Programmable CAS latency 5, 6, 7, 8, 9, 10, 11, 12, 13
and 14 supported
Programmable additive latency 0, CL-1, and CL-2 
supported
Programmable CAS Write latency (CWL) = 5, 6, 7, 8, 9, 10
Programmable burst length 4/8 with both nibble 
sequential and interleave mode
BL switch on the fly
8banks
Average Refresh Cycle (Tcase of0 oC~ 95oC)
- 7.8 µs at 0oC ~ 85 oC
- 3.9 µs at 85oC ~ 95 oC
JEDEC standard 78ball FBGA(x4/x8)
Driver strength selected by EMRS
Dynamic On Die Termination supported
Asynchronous RESET pin supported
ZQ calibration supported
TDQS (Termination Data Strobe) supported (x8 only)
Write Levelization supported
8 bit pre-fetch
This product in compliance with the RoHS directive.

Spezifikationen

Part Life Cycle Code	Obsolete	Pin Count	96
Reach Compliance Code		ECCN Code	EAR99
HTS Code	8542.32.00.32	Access Mode	MULTI BANK PAGE BURST
Additional Feature	AUTO/SELF REFRESH	Clock Frequency-Max (fCLK)	667 MHz
I/O Type	COMMON	Interleaved Burst Length	4,8
JESD-30 Code	R-PBGA-B96	JESD-609 Code	e1
Length	13 mm	Memory Density	1073741824 bit
Memory IC Type	DDR3 DRAM	Memory Width	16
Number of Functions	1	Number of Ports	1
Number of Terminals	96	Number of Words	67108864 words
Number of Words Code	64000000	Operating Mode	SYNCHRONOUS
Operating Temperature-Max	85 °C	Operating Temperature-Min
Organization	64MX16	Output Characteristics	3-STATE
Peak Reflow Temperature (Cel)	260	Power Supplies	1.5 V
Qualification Status	Not Qualified	Refresh Cycles	8192
Seated Height-Max	1.2 mm	Self Refresh	YES
Sequential Burst Length	4,8	Standby Current-Max	0.01 A
Supply Current-Max	0.2 mA	Supply Voltage-Max (Vsup)	1.575 V
Supply Voltage-Min (Vsup)	1.425 V	Supply Voltage-Nom (Vsup)	1.5 V
Surface Mount	YES	Technology	CMOS
Temperature Grade	OTHER	Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form	BALL	Terminal Pitch	0.8 mm
Terminal Position	BOTTOM	Time@Peak Reflow Temperature-Max (s)	20
Width	7.5 mm

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