Bezahlverfahren
LCMXO2-256HC-4SG32C +BOM
The LCMXO2-256HC-4SG32C is a versatile 256 logic cell programmable logic device in a compact 32 QFN-32-EP(5x5) package."
QFN-32-
Hersteller:
Lattice Semiconductor Corporation
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Herstellerteil #:
LCMXO2-256HC-4SG32C
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Datenblatt:
-
Part Life Cycle Code:
Active
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Reach Compliance Code:
compliant
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ECCN Code:
EAR99
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HTS Code:
8542.39.00.01
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EDA/CAD Modelle:
Fordern Sie kostenlose CAD-Modelle für an LCMXO2-256HC-4SG32C
All bill of materials (BOM) can be sent via email to [email protected], or fill below form to Quote for LCMXO2-256HC-4SG32C, guaranteed quotes back within 12hr.
Verfügbarkeit: 7222 Stck
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LCMXO2-256HC-4SG32C Allgemeine Beschreibung
The LCMXO2-256HC-4SG32C FPGA from Lattice Semiconductor is a high-performance device with low power consumption, making it an ideal choice for a wide range of applications. With 256 logic cells and a 4-speed grade, it operates at 32 MHz, delivering efficient processing power for consumer electronics, industrial automation, and communication systems. Its 1.2V core voltage and 90nm non-volatile process technology ensure reliable performance, and support for 3.3V and 2.5V I/O standards enhances its versatility. The FPGA also features embedded block RAM, distributed RAM, and PLLs for effective clock management. Its "HC" designation indicates its suitability for extended temperature ranges, making it a robust solution for use in harsh environments. In summary, the LCMXO2-256HC-4SG32C stands out as a powerful and efficient FPGA that offers high performance, low power consumption, and adaptability, making it a valuable choice for demanding applications
Hauptmerkmale
- Flexible Logic Architecture
- Six devices with 256 to 6864 LUT4s and 19 to 335 I/Os
- Ultra Low Power Devices
- Advanced 65 nm low power process
- As low as 19 µW standby power
- Programmable low swing differential I/Os
- Stand-by mode and other power saving options
- Embedded and Distributed Memory
- Up to 240 Kbits sysMEM™ Embedded Block RAM
- Up to 54 Kbits Distributed RAM
- Dedicated FIFO control logic On-Chip User Flash Memory
- Up to 256 Kbits of User Flash Memory
- 100,000 write cycles
- Accessible through WISHBONE, SPI, I2C and JTAG interfaces
- Can be used as soft processor PROM or as Flash memory
- Pre-Engineered Source Synchronous I/O
- DDR registers in I/O cells
- Dedicated gearing logic
- 7:1 Gearing for Display I/Os
- Generic DDR, DDRX2, DDRX4
- Dedicated DDR/DDR2/LPDDR memory with DQS support
- High Performance, Flexible I/O Buffer
- Programmable sysIO™ buffer supports wide range of interfaces:
- – LVCMOS 3.3/2.5/1.8/1.5/1.2
- – LVTTL
- –PCI
- – LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL
- – SSTL 25/18
- – HSTL 18
- – Schmitt trigger inputs, up to 0.5V hysteresis
- I/Os support hot socketing
- On-chip differential termination
- Programmable pull-up or pull-down mode
Spezifikationen
Part Life Cycle Code | Active | Reach Compliance Code | compliant |
ECCN Code | EAR99 | HTS Code | 8542.39.00.01 |
Additional Feature | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY | JESD-30 Code | S-XQCC-N32 |
Length | 5 mm | Moisture Sensitivity Level | 3 |
Number of CLBs | 32 | Number of Inputs | 21 |
Number of Logic Cells | 256 | Number of Outputs | 21 |
Number of Terminals | 32 | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | Organization | 32 CLBS | |
Packing Method | TRAY | Peak Reflow Temperature (Cel) | 260 |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | Qualification Status | Not Qualified |
Seated Height-Max | 0.6 mm | Supply Voltage-Max (Vsup) | 3.465 V |
Supply Voltage-Min (Vsup) | 2.375 V | Supply Voltage-Nom (Vsup) | 2.5 V |
Surface Mount | YES | Temperature Grade | OTHER |
Terminal Form | NO LEAD | Terminal Pitch | 0.5 mm |
Terminal Position | QUAD | Width | 5 mm |
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In Stock: 7.222
Minimum Order: 1
Menge. | Einzelpreis | Ext. Preis |
---|---|---|
1+ | $4,044 | $4,04 |
10+ | $3,524 | $35,24 |
30+ | $3,213 | $96,39 |
100+ | $2,901 | $290,10 |
490+ | $2,756 | $1.350,44 |
980+ | $2,691 | $2.637,18 |
Die unten angegebenen Preise dienen nur als Referenz.
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