Bezahlverfahren
RC28F256P33TFE +BOM
This memory chip is housed in a compact 64-pin EZBGA package
BGA-64-
Hersteller:
MICRON TECHNOLOGY INC
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Herstellerteil #:
RC28F256P33TFE
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Datenblatt:
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Part Life Cycle Code:
Obsolete
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ECCN Code:
EAR99
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HTS Code:
8542.32.00.51
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Access Time-Max:
95 ns
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EDA/CAD Modelle:
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Verfügbarkeit: 7670 Stck
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RC28F256P33TFE Allgemeine Beschreibung
Intel's RC28F256P33TFE flash memory chip is a game-changer in the world of storage solutions. Offering a spacious 256Mb capacity (32MB), this chip operates on a 3.3-volt power supply and utilizes a parallel interface for seamless data transfer. Its reliability and endurance make it a standout choice for applications requiring frequent read and write operations in embedded systems, automotive electronics, industrial control systems, and consumer electronics. With features like block erase, sector erase, and byte programming, this chip provides unparalleled flexibility in data manipulation, catering to a wide range of user needs. Its compact size and low power consumption make it a top contender for space-constrained and power-sensitive designs in the tech industry
Hauptmerkmale
- High performance
- — 85/88 ns initial access
- — 40 MHz with zero wait states, 20 ns clock-to data output synchronous-burst read mode
- — 25 ns asynchronous-page read mode
- — 4-, 8-, 16-, and continuous-word burst mode
- — Buffered Enhanced Factory Programming (BEFP) at 5 µs/byte (Typ)
- — 1.8 V buffered programming at 7 µs/byte (Typ)
- Architecture
- — Multi-Level Cell Technology: Highest Density at Lowest Cost
- — Asymmetrically-blocked architecture
- — Four 32-KByte parameter blocks: top or bottom configuration
- — 128-KByte main blocks
- Voltage and Power
- —VCC(core) voltage: 1.7 V – 2.0 V
- —VCCQ (I/O) voltage: 1.7 V – 3.6 V
- — Standby current: 55 µA (Typ) for 256-Mbit
- — 4-Word synchronous read current: 13 mA (Typ) at 40 MHz
- Quality and Reliability
- — Operating temperature: –40 °C to +85 °C
- 1-Gbit in SCSP is –30 °C to +85 °C
- — Minimum 100,000 erase cycles per block
- — ETOX™ VIII process technology (130 nm)
- Security
- — One-Time Programmable Registers:
- 64 unique factory device identifier bits
- 64 user-programmable OTP bits
- Additional 2048 user-programmable OTP bits
- — Selectable OTP Space in Main Array:
- 4x32KB parameter blocks + 3x128KB main blocks (top or bottom configuration)
- — Absolute write protection: VPP= VSS
- — Power-transition erase/program lockout
- — Individual zero-latency block locking
- — Individual block lock-down
- Software
- — 20 µs (Typ) program suspend
- — 20 µs (Typ) erase suspend
- —Intel® Flash Data Integrator optimized
- — Basic Command Set and Extended Command Set compatible
- — Common Flash Interface capable
- Density and Packaging
- — 64/128/256-Mbit densities in 56-Lead TSOP package
- — 64/128/256/512-Mbit densities in 64-Ball Intel®Easy BGA package
- — 64/128/256/512-Mbit and 1-Gbit densities in Intel®QUAD+ SCSP
- — 16-bit wide data bus
Spezifikationen
Part Life Cycle Code | Obsolete | Reach Compliance Code | |
ECCN Code | EAR99 | HTS Code | 8542.32.00.51 |
Access Time-Max | 95 ns | Additional Feature | TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE |
Boot Block | TOP | Command User Interface | YES |
Common Flash Interface | YES | Data Polling | NO |
JESD-30 Code | R-PBGA-B64 | JESD-609 Code | e1 |
Length | 13 mm | Memory Density | 268435456 bit |
Memory IC Type | FLASH | Memory Width | 16 |
Number of Functions | 1 | Number of Sectors/Size | 4,255 |
Number of Terminals | 64 | Number of Words | 16777216 words |
Number of Words Code | 16000000 | Operating Mode | SYNCHRONOUS |
Operating Temperature-Max | 85 °C | Operating Temperature-Min | -40 °C |
Organization | 16MX16 | Parallel/Serial | PARALLEL |
Power Supplies | 2.5/3.3 V | Programming Voltage | 3 V |
Qualification Status | Not Qualified | Seated Height-Max | 1.2 mm |
Sector Size | 16K,64K | Standby Current-Max | 0.00021 A |
Supply Current-Max | 0.031 mA | Supply Voltage-Max (Vsup) | 3.6 V |
Supply Voltage-Min (Vsup) | 2.3 V | Supply Voltage-Nom (Vsup) | 3 V |
Surface Mount | YES | Technology | CMOS |
Temperature Grade | INDUSTRIAL | Terminal Finish | TIN SILVER COPPER |
Terminal Form | BALL | Terminal Pitch | 1 mm |
Terminal Position | BOTTOM | Toggle Bit | NO |
Type | NOR TYPE | Width | 10 mm |
Servicerichtlinien und andere
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Qualitätsgarantie
Wir versprechen, 365 Tage Qualitätssicherung für alle unsere Produkte zu bieten.
In Stock: 7.670
Minimum Order: 1
Menge. | Einzelpreis | Ext. Preis |
---|---|---|
1+ | $18,422 | $18,42 |
200+ | $7,351 | $1.470,20 |
500+ | $7,106 | $3.553,00 |
864+ | $6,984 | $6.034,18 |
Die unten angegebenen Preise dienen nur als Referenz.