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THGBMJG7C1LBAIL +BOM

THGBMJG7C1LBAIL is an eMMC ROHS device in FBGA-153 package

THGBMJG7C1LBAIL Allgemeine Beschreibung

Boasting multi-level cell (MLC) NAND technology, the THGBMJG7C1LBAIL delivers enhanced data storage density and improved data retention, making it a top choice for applications requiring substantial data storage in a compact form factor. Its durability is further emphasized by its ability to withstand numerous read and write cycles, ensuring long-term reliability and superior performance. Additionally, built-in error correction and wear-leveling algorithms contribute to prolonging the chip's lifespan, making it a reliable and robust solution for various electronic applications

Spezifikationen

Part Life Cycle Code Obsolete Reach Compliance Code
ECCN Code EAR99 HTS Code 8542.32.00.51
JESD-30 Code R-PBGA-B153 Length 13 mm
Memory Density 137438953472 bit Memory IC Type Embedded MMC
Memory Width 8 Number of Functions 1
Number of Terminals 153 Number of Words 17179869184 words
Number of Words Code 16000000000 Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C Operating Temperature-Min -25 °C
Organization 16GX8 Seated Height-Max 0.8 mm
Supply Voltage-Max (Vsup) 3.6 V Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V Surface Mount YES
Technology CMOS Temperature Grade OTHER
Terminal Form BALL Terminal Pitch 0.5 mm
Terminal Position BOTTOM Type NAND TYPE
Width 11 mm

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Bewertungen und Rezensionen

Mehr
A
A**a 12.05.2022

Impressed with Avaq's dedication to customer satisfaction! Not only did they deliver the original RTL8153-VC-CG components on time, but their proactive communication throughout the process was remarkable. - Karen T.

17
J
J**h 02.10.2021

It came quickly, how it works to look after receiving the batteries.

17
L
L**s 12.06.2020

Excellent!---I haven't tried it yet.

8
E
E**n 07.23.2020

Not solid, inside hollow. Quality is good.

9

Rezensionen

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