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FDG6332C +BOM

Package Type: 6-Pin SC-70

FDG6332C Röntgeninspektion

X-Ray inspection ensures product integrity by detecting internal defects without damaging external packaging. It reduces failure rates and enhances production efficiency, making it indispensable in the electronics components industry.

FDG6332C

FDG6332C Allgemeine Beschreibung

Engineered with precision and innovation, the FDG6332C N & P-Channel MOSFETs set a new standard for power management components. Their specialized PowerTrench process delivers superior performance in terms of on-state resistance and switching characteristics, making them a standout choice for demanding applications. The compact size of these devices further enhances their versatility, making them a practical solution for projects where space optimization is paramount

Hauptmerkmale

  • Low thermal resistance, high reliability
  • High current capability, long lifespan
  • Rapid response time, precise control

Anwendung

  • Suitable for various purposes.

Spezifikationen

Product Category MOSFET Technology Si
Mounting Style SMD/SMT Transistor Polarity N-Channel, P-Channel
Number of Channels 2 Channel Vds - Drain-Source Breakdown Voltage 20 V
Id - Continuous Drain Current 700 mA Rds On - Drain-Source Resistance 300 mOhms
Vgs - Gate-Source Voltage - 12 V, + 12 V Vgs th - Gate-Source Threshold Voltage 600 mV, 1.5 V
Qg - Gate Charge 1.5 nC, 2 nC Minimum Operating Temperature - 55 C
Maximum Operating Temperature + 150 C Pd - Power Dissipation 300 mW
Channel Mode Enhancement Tradename PowerTrench
Series FDG6332C Configuration Dual
Fall Time 7 ns, 14 ns Forward Transconductance - Min 2.8 S, 1.8 S
Height 1.1 mm Length 2 mm
Product MOSFET Small Signals Product Type MOSFET
Rise Time 7 ns, 14 ns Factory Pack Quantity 3000
Subcategory MOSFETs Transistor Type 1 N-Channel, 1 P-Channel
Type MOSFET Typical Turn-Off Delay Time 9 ns, 6 ns
Typical Turn-On Delay Time 5 ns, 5.5 ns Width 1.25 mm
Part # Aliases FDG6332C_NL Unit Weight 0.000988 oz

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